Interflux® LMPA-Q7 is a low-melting solder paste with optimized printing characteristics and exceptional mechanical performance. As the successor to LMPA-Q6, LMPA-Q7 builds on its predecessor’s strengths. It is a no-clean solder paste that features the highly reliable, low-melting LMPA-Q alloy—offering superior performance compared to standard SnBi(Ag) alloys. This enables easier processing of temperature-sensitive components while reducing overall production costs. In addition, LMPA-Q7 delivers extended stencil life and enhanced printability.

Interflux^® IF 9057 is a no-clean, halogen-free, lead-free solder paste developed for enhanced stencil stability and transparent residues after reflow. It is particularly well-suited for pin-in-paste (PiP) applications, with a rheology that ensures excellent adhesion to component leads and vias. IF 9057 also performs exceptionally well in vapor-phase soldering processes.

Unlike many other solder pastes, IF 9057 significantly reduces the "tombstoning effect," as its residues remain in place and do not flow. For maximum suppression of tombstoning, the IF 9057 ATL variant is recommended.

Conformity: ROL0 according to IPC and EN standards

Halogen content: 0.00%

Interflux® DP 5505 is a versatile, highly stable, no-clean solder paste suitable for both lead-free and SnPb(Ag) alloys. It offers excellent resistance to moisture and temperature, and its rheology supports high printing speeds—even with fine apertures—making it ideal for PiP (Pin-in-Paste) applications.

The paste’s advanced chemistry minimizes void formation and meets the stringent requirements of IPC 7095 Class 3 for voiding performance. Additionally, DP 5505 is halogen-free, ensuring maximum post-soldering reliability.

Conformity: ROL0 according to EN and IPC standards

Halogen content: 0.00%

Interflux^® µ-dIFe 7 no-clean solder paste was specifically developed for dipping applications. It is ideally suited for BGA components, as well as gull-wing and J-lead terminations.

Conformity: ROL0 according to EN and IPC standards

Halogen content: 0.00%

WSP 2006 is a 100% halogen-free, water-based solder paste with water-soluble residues. It exhibits low corrosive effects after soldering, but the residues must be cleaned.
WSP 2006 is characterized by good rheological properties, acceptable stencil stability, and reliable wetting behavior on most surface finishes. Together, these features provide a wide process window during printing.