Interflux® lead-free, lead-containing & water-based solder pastes
Interflux® LMPA-Q7 is a low-melting solder paste with optimized printing properties and improved mechanical properties. LMPA-Q7 is the successor to LMPA-Q6. LMPA-Q7 is a no-clean solder paste with the highly reliable low-melting LMPA-Q alloy. This simplifies the use of temperature-sensitive components and reduces production costs. The new LMPA-Q7 solder paste offers a longer service life on the stencil in combination with optimized printability. The LMPA-Q alloy has better mechanical properties than standard SnBi(Ag) alloys.
Interflux® LMPA-Q7
Interflux® IF 9057 is a no-clean, halogen-free and lead-free solder paste that has been developed for increased stability on the stencil and transparent residues after reflow. This solder paste is very suitable for pin-in-paste (PiP) applications. The rheology ensures excellent adhesion to component leads and vias. IF 9057 solder paste is extremely effective in a vapor phase soldering process. In contrast to other solder pastes, the tombstoning effect is significantly reduced as the residues do not flow out. The ATL version of this solder paste is recommended to achieve the best possible tombstoning effect.
Conformity: RO L0 according to IPC and EN standards
Halogen content: 0.00 %
Interflux® IF 9057
For lead-free and SnPb(Ag) alloys, Interflux® DP 5505 is a versatile, highly stable, no-clean solder paste. Its resistance to moisture and temperature is very high. Even with small openings, the rheology of DP 5505 allows high printing speeds and is ideal for pin-in-paste applications. The chemistry of DP5505 has been developed to reduce the formation of voids. The solder paste is suitable for IPC 7095 voiding class 3. The DP 5505 solder paste is halogen-free and ensures maximum reliability after soldering.
Conformity: RO L0 according to EN and IPC standards
Interflux® DP 5505
The lead-free Interflux® µ-dIFe 7 no-clean solder paste is suitable for dipping applications. This solder paste has been specially developed for application by dipping and is best suited for BGA components, but also for gull-wing and J-connections.
Interflux® µ-dIFe 7
Interflux ® WSP 2006 is an absolutely halogen-free, water-based solder paste with water-soluble residues. This solder paste has a low corrosion effect after soldering. The residues of WSP 2006 must be cleaned. In general, WSP 2006 solder paste is characterized by good rheological properties, acceptable stability on the stencil and good wetting behaviour on most surface coatings. This ensures a large process window during printing.