Here you will find lead-free, leaded & water-based solder wires from Interflux®:
The Interflux® IF 14 series are colophony-free, absolutely halogen-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys. The flux body of the IF 14 solder wire can evaporate almost completely, leaving a residue that can be easily removed with a hand brush. This results in clean solder joints which are almost indistinguishable from wave or reflow soldered joints.
Flux content lead-free: 1.6 % or 2.2 %
Flux content SnPb(Ag): 0.6 %, 0.9 % or 1.4 %
Conformity: RE L0 according to EN and IPC standards
Interflux® IF 14 Serie
Interflux® Flexsol 903 is an absolutely halogen-free, no-clean solder wire with reduced spattering properties in lead-free alloys. The solder wire exhibits good wetting on the conventional surfaces to be soldered in conjunction with low spattering behavior. The solder wire with 2.2 % flux content is used for soldering SMD components, normal vias or when low residue formation is required. The solder wire with 3.5 % flux is used for soldering thermally heavy vias or for shorter soldering times.
Flux content: 2.2 % or 3.5 %
Conformity: RO L0 according to EN and IPC standards
Interflux® Flexsol 903
Interflux® RosIX 705 is an activated rosin-based no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder such as OSP, Ni, Zn, brass, nickel silver etc. as well as on degraded and oxidized surfaces. RosIX 705 can be used for both manual and robotic soldering.
Flux content: 3.5 %
Conformity: RO L1 according to EN and IPC standards.
Interflux® RosIX 705
Interflux® NH 1 is an activated no-clean rosin and lead-free solder wire that ensures fast and reproducible soldering results on a variety of surfaces, including brass. The advantages of NH 1 are its fast wetting and low spattering, making it particularly suitable for robot and laser soldering, but also for normal manual soldering. In addition, the NH1 solder wire is particularly suitable for applications with high throughputs, where safe and reliable solder joints must be formed.
Flux content: 1.6 % or 2.2 %
Conformity: RE L1 according to IPC and EN standards
Interflux® NH 1