Here you will find lead-free, leaded & water-based solder wires from Interflux®:
Interflux® IF 14 series comprises colophony-free, 100% halogen-free, no-clean solder wires available in SnPb(Ag) and lead-free alloys. The flux core of the IF 14 Series evaporates almost completely during soldering, leaving behind minimal, dry residues that can be easily removed with a hand brush.This results in clean, professional solder joints that are nearly indistinguishable from those produced by wave or reflow soldering.
Flux content (lead-free): 1.6% or 2.2%
Flux content (SnPb[Ag]): 0.6%, 0.9%, or 1.4%
Conformity: RE L0 according to EN and IPC standards
Interflux® IF 14 Serie
Interflux® Flexsol 903 is a 100% halogen-free, no-clean solder wire formulated for reduced spattering in lead-free alloys. It provides excellent wetting on standard solderable surfaces, while maintaining a low-spatter profile.
The 2.2% flux version is ideal for soldering SMD components and standard vias, or whenever minimal residue formation is required.The 3.5% flux version is recommended for thermally demanding vias or where shorter soldering times are desired.
Flux content: 2.2% or 3.5%
Conformity: RO L0 according to EN and IPC standards
Interflux® Flexsol 903
Interflux® RosIX 705 is an activated, rosin-based, no-clean solder wire with enhanced wetting performance for lead-free and SnPb(Ag) alloys. It is suitable for difficult-to-solder surfaces such as OSP, Ni, Zn, brass, nickel, and silver, as well as aged or oxidized surfaces.
RosIX 705 is versatile and can be used in both manual and robotic soldering applications.
Flux content: 3.5%
Conformity: RO L1 according to EN and IPC standards
Interflux® RosIX 705
Interflux® NH 1 is an activated, no-clean, rosin-based, lead-free solder wire that delivers fast and reproducible soldering results on a wide range of surfaces — including brass.Its key advantages are rapid wetting and minimal spattering, making it especially well-suited for robotic and laser soldering, as well as for standard manual soldering.NH 1 is ideal for high-throughput applications where safe and reliable solder joints are essential.
Flux content: 1.6% or 2.2%
Conformity: RE L1 according to IPC and EN standards
Interflux® NH 1