The Parylene coating process is unique in the coating technology. The deposition process of polymers occurs at molecular level and provides:The first step is the vaporization of firm dimer. The dimer is heated to a temperature of 160°C and is dissipated in a gas. The gas is then pyrolysed (thermo chemical cleavage of organic compounds) to crack the dimer in his monomeric form. The monomeric gas is deposited in the deposition chamber under room temperature as a transparent polymeric film. The obtained coating thickness can vary with the application and can amount from 0,2 up to 100 µm pro run.
The Parylene coating is deposited under vacuum through condensation out of the gaseous phase as a non porous and transparent polymeric film on the substrate material. Practically every vacuum suitable substrate material such as metal, glass, paper, varnish, plastics, ferrite and silicon, even objects such as plants, insects or archaeological artifacts are coatable with Parylene.
The equipment spectrum reaches form serial equipment up to nonstandard equipment, systems of different sizes are available.
From the connection of two identical molecules results one of the most important dimer from the big group of polymers that is used for conform Parylene coatings. Corresponding to the purity of the dimer and the equipment technology, you can produce an absolute conform coating with an optimal protection of the substrate material.
used for very good electric and phyical properties
used for high dielectric and highest coating penetration
used for high barrier layer and temperature protection