Soldering fluxes

The "no clean" soldering fluxes from Interflux are classified in accordance with the standards IPC-J-STD-004A and OR/L0. All soldering fluxes are halide-free (no F, Cl, Br, I,) - what guarantees a high reliability.

• OR/L0 according to EN and IPC standards
• no contact problems on IC-test, rosin-free
• high level of compatibility with any protective coating without cleaning

Alcohol based soldering fluxes

• IF 2005M - ORL0, 1,8 %, for wave soldering leaded 
• IF 2005K - ORL0, 2,5 %, for wave soldering lead-free
• IF 2005C - ORL0, 3,4 %, for selective soldering lead-free
• IF 3006 - ORL0, 3,2 %, for wave and selective soldering leaded and lead-free
• T 2005M - thinner for the IF2005-series fluxes when used in foam fluxing
• OSPI 3311 - ORL0, for soldering OSP finished boards

Water based soldering fluxes (VOC-free)

• PacIFic 2009M - ORL0, 3,7 %, for wave soldering lead-free
• PacIFic 2009MLF - ORL0, 3,7 %, for wave and selective soldering lead-free, minimizes micro solder ball formation
• PacIFic 2009MLF-E - ORL0, 3,7 %, for wave and selective soldering lead-free, reduced micro solder ball formation
• PacIFic 2010F - ORL0, 2,5 %, for wave soldering lead-free, for foam fluxing
• PacIFic 2011F - ORL0, 3,7 %, for wave soldering lead-free, for foam fluxing
• SelectIF 2040 – ORL0, 6,5% , for selective soldering lead-free, wide process window and low residue formation